JPS6315433A - 内部リ−ド接合装置 - Google Patents

内部リ−ド接合装置

Info

Publication number
JPS6315433A
JPS6315433A JP15884086A JP15884086A JPS6315433A JP S6315433 A JPS6315433 A JP S6315433A JP 15884086 A JP15884086 A JP 15884086A JP 15884086 A JP15884086 A JP 15884086A JP S6315433 A JPS6315433 A JP S6315433A
Authority
JP
Japan
Prior art keywords
carrier
clamper
carrier guide
internal lead
guide member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15884086A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458183B2 (en]
Inventor
Yasunobu Suzuki
鈴木　安信
Hisao Ishida
久雄 石田
Akihiro Nishimura
明浩 西村
Hiroshi Yamaguchi
弘 山口
Naoki Awamura
直樹 粟村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
UNION KOGAKU KK
Original Assignee
Shinkawa Ltd
UNION KOGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, UNION KOGAKU KK filed Critical Shinkawa Ltd
Priority to JP15884086A priority Critical patent/JPS6315433A/ja
Publication of JPS6315433A publication Critical patent/JPS6315433A/ja
Publication of JPH0458183B2 publication Critical patent/JPH0458183B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP15884086A 1986-07-08 1986-07-08 内部リ−ド接合装置 Granted JPS6315433A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15884086A JPS6315433A (ja) 1986-07-08 1986-07-08 内部リ−ド接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15884086A JPS6315433A (ja) 1986-07-08 1986-07-08 内部リ−ド接合装置

Publications (2)

Publication Number Publication Date
JPS6315433A true JPS6315433A (ja) 1988-01-22
JPH0458183B2 JPH0458183B2 (en]) 1992-09-16

Family

ID=15680552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15884086A Granted JPS6315433A (ja) 1986-07-08 1986-07-08 内部リ−ド接合装置

Country Status (1)

Country Link
JP (1) JPS6315433A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02273949A (ja) * 1989-04-17 1990-11-08 Shinkawa Ltd テープボンデイング装置
US5120391A (en) * 1989-04-17 1992-06-09 Kabushiki Kaisha Shinkawa Tape bonding apparatus
US5660318A (en) * 1995-04-24 1997-08-26 Samsung Electronics Co., Ltd. Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02273949A (ja) * 1989-04-17 1990-11-08 Shinkawa Ltd テープボンデイング装置
US5120391A (en) * 1989-04-17 1992-06-09 Kabushiki Kaisha Shinkawa Tape bonding apparatus
US5660318A (en) * 1995-04-24 1997-08-26 Samsung Electronics Co., Ltd. Apparatus for inner lead bonding (ILB) comprising a heat dissipation pin and method of ILB using such an apparatus

Also Published As

Publication number Publication date
JPH0458183B2 (en]) 1992-09-16

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